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Nowadays, power electronics play an important role in motor drives, utility interfaces based on renewable energy sources, power converters, power transmission, electric or hybrid vehicles and many other industrial applications. Moreover, the advancements in the power semiconductor technology with the emergence of wide band-gap devices have pushed the conversion efficiency of power electronics to very high levels, where however the reliability of power electronics is becoming more and more vital, and should draw more attention. In this context, the reliability assessment and improvement of power electronic systems should be addressed efficiently. Indeed, it is important to design for reliable power electronic systems to lower the risks of many failures during operation. This track session will focus on fundamental understanding of the physical reliability and mechanisms governing failure in a large variety of advanced semiconductor devices and systems, the electrical – physical failure analysis techniques, the methodologies and tools that could be used to reliably identify the root cause of failure in these devices.


The TPC is inviting papers related, but not limited to, the following areas:

  • Reliability Tools, Test Methods, and Equipment
  • Consumer Electronics Reliability
  • Electronic System Reliability
  • Thermal storage and cycling tests
  • Semiconductor Failure Mechanisms & Reliability
  • Reliability of Microwave wide band-gap devices
  • HTRB , HTGB and ESD tests
  • Circuit Aging Simulation and test
  • Photonics, MEMS and sensors Reliability
  • Power Devices Reliability and Failure Analysis
  • 3D Device Failure Analysis
  • Progress in Failure Analysis
  • Emerging Failure Analysis Techniques
  • Mixed Mode & High Power Devices
  • Packaging reliability
  • Electronics for harsh environments

Committees & Submission


  • Pascal Dherbécourt, Normandie Université, France
  • Ahmed El Oualkadi, Abdelmalek Essaadi University, Morocco

Program Committee

  • Mouloud Challah, University of Boumerdes, Algeria
  • Fethi Choubani, SUP’COM, Tunisia
  • Pascal Dherbécourt, Normandie Université, France
  • Ahmed El Oualkadi, Abdelmalek Essaadi University, Morocco
  • Philippe Eudeline, Thales Air Systems, France
  • Eric Joubert, Normandie Université, France
  • Moncef Kadi, Esigelec, France
  • Olivier Latry, Normandie Université, France
  • Hichame Maanane, Thales Optronique, France
  • Mohamed Masmoudi, Normandie Université, France
  • Ahmed Rhif, Polytechnic School, Tunisia

Papers submissions

Prospective authors should submit, by using the EDAS online platform, a paper of 6 pages maximum, including references and describing their original work, using the IEEE template. Publications Accepted papers will be published in the proceeding in the IEEE Xplore.

Important dATES

  • Paper Submission October 29, 2017
  • Acceptance Notification December 03, 2017
  • Camera-ready Submission December 24, 2017
  • Track Dates May 2-3, 2018